Yes, Al, your sentence is fine. It’s only ambiguous out of context, and if you know absolutely nothing about the topic. You’d probably have to be purposefully obtuse to make a mistake while reading it. Now, we could look at [If only words were easy]’s grammar and find plenty to complain about:

The first sentence the quote is lacking quotation marks, which make it seem like an incomplete thought. However you could not fix it simply by adding quotation marks, because we’d then be left with a subject with no predicate.

In the second sentence there no subject at all.

In the third sentence, he/she misspells the word “pretty.”

In the last sentence he/she places the question mark outside of the quotation marks, which is wrong in American English but acceptable in British English.

Throughout the comment, he/she places each sentence on a new line, but he/she is not making a list. That is wrong in every English speaking country that I am aware of.

Actually silicone chips do degrade faster when warm. And “warranties” are partly based on the mean time between failures at the max operating temperature and an expected duty cycle. (There is a difference between warranty and how long the product is built to survive on average. The warranty is noticeably shorter, since having even 10% of customers ask for new chips due to normal failures is going to eat into profit margins rather quickly.)

Consumer chips for an example aren’t expected to run 24/7 year round, and can therefor be given a higher peak operating temperature, and thereby higher peak performance.

While server chips that are expected to run more continuously tend to have lower peak temperatures. Since long term operation is generally more important than a few % more performance up front.

Though, a lot of CPUs and even GPUs do have additional avenues for failure. Be it thermal cycling cracking solder joints, or just the copper interconnects diffusing and spreading into the semiconductor junctions increasing leakage and eventually killing the chip.

Copper is poison to most semiconductors. The diffusion barriers in the chip only greatly reduce the speed of diffusion, they do not stop it.

There is two main types of diffusion barriers in chips, one can encases the individual interconnects, or one makes a diffusion layer across the whole surface of the chip bellow a given metal layer. Ie, everything above is copper, everything bellow is aluminium.

One of the main power consuming aspects of modern chips is charging and discharging parasitic capacitance in the interconnects, and this is proportional to the surface area of the conductor and their separation from other conductors and the material between the conductors, as well as the resistance of the trace itself. Going from the standard aluminium over to copper can reduce the surface area, since copper needs less cross sectional area for the same resistance (Al has 58% more resistance). But a diffusion barrier is needed to not have the chip die in a matter of weeks/months.

There is however downsides with thicker diffusion barriers in both approaches. If we encase the traces, then the diffusion barrier typically comes in with a high dielectric constant and adds a ton of capacitance that we tried to avoid. So we don’t want it too thick, since it negates the main benefit of going with copper.

If we use a diffusion layer instead, then making it thicker will require us to send our signals through a fairly large vertical conductor, this adds surface area, not to mention that at our smaller interconnect layers our traces have fairly high resistance, since they are either aluminium, or tungsten (3x more resistance than copper). So adding length to our traces makes it harder to drive our traces, and our diffusion barrier also comes in with its higher capacitance as well, worsening the issue.

Making the diffusion barriers thinner does make these issues less problematic, but our copper can diffuse through our barrier faster. So it is a trade between upfront performance or life expectancy. (One can go with aluminium, but 58% more resistance is a hard pill to swallow in most high performance applications.)

Also, the reason copper is poison and not aluminium is because aluminium is a weak P dopant in silicone and will make a depletion region in contact with N dopants. While copper doesn’t care about making depletion regions and instead just makes the semiconductor more conductive, increasing leakage through our transistors. (Tungsten is also poison for our transistors, but Tungsten doesn’t really diffuse much. Some might think of going with silver, but it too is poison.)

However, for chips running bellow 1 GHz, copper interconnects gets progressively more rare as the designed clock frequency decreases. And since charging/discharging times are longer for a state change, then peak currents are lower too, making the difference in resistance more meaningless. For sub 1MHz chips, only power transistors are left using copper to be fair. And building copper interconnects is also more expensive, so for these low speed chips going with copper is a costly pointless thing to do, unless one builds power transistors with low RDS(on) values.